Nanofabrication and Devices Facilities
In this facility, controlled synthesis and directed assembly of nanomaterials; lithographically assisted patterning of hybrid structures; chemical and biological functionalization of nanoscale materials; electron-beam lithography, focused ion beams, and nanoimprint patterning methods are performed.
Capabilities
Lithography
- 100-kV electron-beam lithography (JEOL 9300 FS)
- 30-kV electron-beam lithography (Raith 150)
- Focused ion beam/scanning electronc microscopy (FEI Nova 600 NanoLab Dual Beam)
- Step-and-repeat nanoimprint (Nanonex NX-3000)
- Optical mask aligner (Karl Suss MA6)
Resist Processing
- Spin coaters
- Hot plates
- Bake oven
- HMDS priming oven
Plasma Processing
- Inductive coupled plasma reactive ion etching chlorine chamber (Cl2, SF6, BCl3, HBr, CHF3, CO, O2, Ar) (Oxford Instruments Plasmalab 100)
- Reactive ion etching fluorine chamber (SF6, CF4, CH4, CHF3, HCFC-124, H2, O2, Ar) (Oxford Instruments Plasmalab 100 )
- Table-top reactive ion etching chlorine chamber (Cl2, CH4, H2, O2, Ar) (March Plasma)
- Table-top reactive ion etching fluorine chamber (SF6, CF4, H2, O2, Ar) (March Plasma)
- Table-top reactive ion etcher (CF, SF6, Ar, O2) (Plasma Sciences 600)
- Barrel asher system (Ar, N2, O2) (PlasmaTherm)
Wet Processing
- Wafer rinse dryer tool (2-, 4-, and 6-inch)
- Electroforming (Au, Cu, Ni, Pt)
- Silicon anisotropic etching, membrane fabrication
- Wet etching
- Potentiostat
Metrology
- Optical microscope (Olympus MX-61)
- Three-dimensional surface profilometer (Veeco Dektak 8)
- Profilometer (Tencor Alpha Step 500)
- Reflectometer (Filmetrics)
- Scanning vibrating electrode (Princeton)
- Far-ultraviolet – near-infrared spectroscopic ellipsometer (Horiba Jobin Yvon UVISEL)
- Scanning probe microscope (PSIA XE-HDD with 6-inch wafer stage)
- Contact and non-contact modes
- Scanning thermal microscopy
- Magnetic force microscopy
Deposition
- PECVD nanocrystalline diamond deposition (Lambda)
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